According to iThome, major memory chipmaker Winbond Electronics (華邦電子) issued a material cybersecurity announcement on the evening of June 6 stating that an unidentified party had breached a partner vendor's IT systems, resulting in a suspected leak of Winbond-related data [1]. According to Winbond's filing, the incident originated in the partner vendor's IT environment, and after the partner notified Winbond that data related to their collaboration might have been exposed, Winbond issued a material disclosure to explain the situation [1]. However, the company did not disclose the identity of the breached partner vendor [1].
Winbond Electronics Issues Material Filing on Suspected Data Leak Following Breach at Partner Vendor
1 min read
- Disclosed
- Jun 11, 2024
- Published
- Nov 8, 2026
- Last updated
- Nov 7, 2026
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However, the company did not disclose the identity of the breached partner vendor [1].
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- Media reports on the cybersecurity incident[1]
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Source excerpt for verification: "記憶體大廠華邦電子在6月6日傍晚發布資安事件重大訊息,說明他們合作廠商的資訊系統遭不明人士入侵,導致該公司疑似發生資料外洩的狀況。" [1].
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Media1
- [1]
“記憶體大廠華邦電子在6月6日傍晚發布資安事件重大訊息,說明他們合作廠商的資訊系統遭不明人士入侵,導致該公司疑似發生資料外洩的狀況。”
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